TSE - TS EN 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
active, Most Current
| Organization: | TSE |
| Publication Date: | 24 June 2010 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
TS EN 60749-20-1
June 24, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.