TSE - TS IEC 60191-5
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
active, Most Current
| Organization: | TSE |
| Publication Date: | 18 February 2016 |
| Status: | active |
| ICS Code (Semiconductor devices): | 31.080 |
Document History
TS IEC 60191-5
February 18, 2016
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
A description is not available for this item.