TSE - TS EN ISO 9453
Soft solder alloys - Chemical compositions and forms
active
| Organization: | TSE |
| Publication Date: | 13 November 2014 |
| Status: | active |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
This International Standard specifies the requirements forchemical composition for soft solder alloys containing two or moreof tin, lead, antimony, copper, silver, bismuth, zinc, indiumand/or cadmium.
Document History
December 4, 2015
Soft solder alloys - Chemical compositions and forms
Bu Standard, kalay, kursun, antimon, bakir, gumus, bizmut,cinko, indiyum ve/veya kadmiyumdan iki yada daha fazlasini icerenyumusak lehim alasimlari icin kimyasal bilesimleringerekliliklerini belirtir.
TS EN ISO 9453
November 13, 2014
Soft solder alloys - Chemical compositions and forms
This International Standard specifies the requirements forchemical composition for soft solder alloys containing two or moreof tin, lead, antimony, copper, silver, bismuth, zinc, indiumand/or cadmium.
March 27, 2007
Soft solder alloys - Chemical compositions and forms
A description is not available for this item.