TSE - TS EN 61189-5-4
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
active, Most Current
| Organization: | TSE |
| Publication Date: | 30 April 2015 |
| Status: | active |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
IEC 61189 bu bolumu yontemlerini temsil test yontemleri birkatalog ve baskili devre meclislerinin test uygulanabilirprosedu
Document History
TS EN 61189-5-4
April 30, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61189 bu bolumu yontemlerini temsil test yontemleri birkatalog ve baskili devre meclislerinin test uygulanabilirprosedurler .