TSE - TS EN 60191-6
Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
active, Most Current
| Organization: | TSE |
| Publication Date: | 23 March 2010 |
| Status: | active |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
TS EN 60191-6
March 23, 2010
Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.
March 31, 2005
IEC 60191-6, Ed. 2: Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface- mounted semiconductor device packages
This standard covers the determination of resistance of paint films to fungal and mould growth.