TSE - TS EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
active, Most Current
| Organization: | TSE |
| Publication Date: | 13 July 2010 |
| Status: | active |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
TS EN 61191-6
July 13, 2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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