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TSE - TS EN 60191-6-17

Mechanical standardization of semiconductor devices -Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (PPFBGA and P-PFLGA)

active, Most Current
Organization: TSE
Publication Date: 22 November 2011
Status: active
ICS Code (Semiconductor devices in general): 31.080.01

Document History

TS EN 60191-6-17
November 22, 2011
Mechanical standardization of semiconductor devices -Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (PPFBGA and P-PFLGA)
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