TSE - TS EN 62047-13
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
active, Most Current
| Organization: | TSE |
| Publication Date: | 5 June 2012 |
| Status: | active |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
TS EN 62047-13
June 5, 2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
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