DIN IEC 60068-2-83
Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 2007 |
| Status: | inactive |
| Page Count: | 55 |
| ICS Code (Environmental testing): | 19.040 |
Document History
DIN IEC 60068-2-83
September 1, 2007
Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
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