TSE - TS EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
active, Most Current
| Organization: | TSE |
| Publication Date: | 13 July 2010 |
| Status: | active |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
TS EN 60191-6-19
July 13, 2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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