TSE - TS EN 62047-26
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
| Organization: | TSE |
| Publication Date: | 9 December 2016 |
| Status: | active |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies descriptions of trenchstructure and needle structure in a micrometer scale. In addition,it provides examples of measurement for the geometry of bothstructures. For trench structures, this standard applies tostructures with a depth of 1 ?m to 100 ?m; walls and trenches withrespective widths of 5 ?m to 150 ?m; and aspect ratio of 0,006 7 to20. For needle structures, the standard applies to structures withthree or four faces with a height, horizontal width and verticalwidth of 2 ?m or larger, and with dimensions that fit inside a cubewith sides of 100 ?m. This standard is applicable to the structuraldesign of MEMS and geometrical evaluation after MEMS processes.
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