scope:

This part of IEC 62047 specifies a tensile test method tomeasure electromechanical properties of conductive thinmicro-electromechanical systems (MEMS) materials bonded onnon-conductive flexible substrates. Conductive thin-film structureson flexible substrates are extensively utilized in MEMS, consumerproducts, and flexible electronics. The electrical behaviours offilms on flexible substrates differ from those of freestandingfilms and substrates due to their interfacial interactions.Different combinations of flexible substrates and thin films oftenlead to various influences on the test results depending on thetest conditions and the interfacial adhesion. The desired thicknessof a thin MEMS material is 50 times thinner than that of theflexible substrate, whereas all other dimensions are similar toeach other.