TSE - TS EN 60749-19/A1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
active
| Organization: | TSE |
| Publication Date: | 13 January 2011 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
March 29, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Bu standard, yari iletken yongaciklarin paket govde veya digertaban malzemesine tutturulmasinda kullanilan islemlerin vemalzemelerin butunlugunu kapsar.
TS EN 60749-19/A1
January 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
A description is not available for this item.
April 29, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Bu standard, yari iletken yongaciklarin paket govde veya digertaban malzemesine tutturulmasinda kullanilan islemlerin vemalzemelerin butunlugunu kapsar.
January 28, 2004
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.