TSE - TS EN 60068-2-69
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
active
| Organization: | TSE |
| Publication Date: | 29 April 2008 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
Document History
September 19, 2014
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
IEC 60068 bu bolumu deney Te, lehim banyo islatma bakiye yontemive lehim ozetliyor Yuzey montaj cihazlar icin gecerlidir islatmabakiye yontemi, kurecik. Bu yontemler kantitatif yuzey montajcihazlarda...
TS EN 60068-2-69
April 29, 2008
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
A description is not available for this item.
October 17, 2000
Environmental testing-Part 2: tests-Test Te: Solderability Testing of electronic components for surface mount technology by the wetting balance method
Bu uluslararasi standard iki islanma deney metodunu tarif eder.Bu metotlar yuzeye monteli ekranlardaki (YME) uclarinlehimlenebilirligini nicel sekilde belirler. Prosedurler lehimbanyosu islanma deney...