TSE - TS EN 61190-1-3/A1
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
active, Most Current
| Organization: | TSE |
| Publication Date: | 5 June 2012 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
TS EN 61190-1-3/A1
June 5, 2012
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
April 29, 2008
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
November 11, 2002
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002) / Note: Endorsement notice
Bu standard, pvc malzemeden ekstrüde edilmiş, ısıyla büzülemeyen üç tip manşon ile ilgili kuralları kapsar.