TSE - TS EN 62739-1
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing
active, Most Current
| Organization: | TSE |
| Publication Date: | 13 February 2014 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
TS EN 62739-1
February 13, 2014
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing
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