TSE - TS EN 62137-4/AC
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
active, Most Current
| Organization: | TSE |
| Publication Date: | 30 April 2015 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
IEC 62137 bu bolumu termo - mekanik strese karsi lehimdayaniklilik degerlendirmek icin baskili devre kartina monte alandizi turu paketleri lehim eklemleri icin deney metodunu kapsar.
Document History
TS EN 62137-4/AC
April 30, 2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
IEC 62137 bu bolumu termo - mekanik strese karsi lehimdayaniklilik degerlendirmek icin baskili devre kartina monte alandizi turu paketleri lehim eklemleri icin deney metodunu kapsar.
February 18, 2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
This part of IEC 62137 specifies the test method for the solderjoints of area array type packages mounted on the printed wiringboard to evaluate solder joint durability against...