TSE - TS EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
active, Most Current
| Organization: | TSE |
| Publication Date: | 9 December 2016 |
| Status: | active |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies a test method to monitor theresistance of single platedthrough holes (PTHs) in printed circuitboards (PCBs) to determine the PTH durability underthermo-mechanic
Document History
TS EN 61189-3-719
December 9, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
This part of IEC 61189 specifies a test method to monitor theresistance of single platedthrough holes (PTHs) in printed circuitboards (PCBs) to determine the PTH durability underthermo-mechanical...