CEI EN 60749-3
Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination
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| Organization: | CEI |
| Publication Date: | 1 October 2017 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
Document History
CEI EN 60749-3
October 1, 2017
Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
March 1, 2004
Semiconductor devices - Mechanical and climatic test method - Part 3: External visual inspection
La presente norma internazionale fa parte della serie IEC 60749 ed ha lo scopo di verificare che i materiali, la progettazione, la costruzione e le marcature di un dispositivo a semiconduttori siano...