UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

CENELEC - EN 60747-16-3

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

active, Most Current
Organization: CENELEC
Publication Date: 1 July 2002
Status: active
Page Count: 52
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.

Document History

EN 60747-16-3
July 1, 2002
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.
EN 60747-16-3
July 1, 2002
Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters
A description is not available for this item.
EN 60747-16-3
July 1, 2002
Semiconductor Devices Part 16-3: Microwave Integrated Circuits Frequency Converters
A description is not available for this item.

References

This document references:
CLC/TR 61340-5-2 - Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
Published by CENELEC on April 1, 2008
A description is not available for this item.
This document references:
EN 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
Published by CENELEC on November 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
IEC 60050-702 - International Electrotechnical Vocabulary Chapter 702: Oscillations, Signals and Related Devices
Published by IEC on March 1, 1992
FOREWORD 1) The formal decisions or agreements of the IEC on technical matters, prepared by Technical Committees on which all the National Committees having a special interest therein are...
This document references:
IEC 60617 DATABASE - Graphical symbols for diagrams
Published by IHS
A description is not available for this item.
This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document is referenced by:
BS EN 60747-16-10 - Semiconductor devices Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
Published by BSI on November 9, 2004
A description is not available for this item.
This document is referenced by:
BS EN 60747-16-5 - Semiconductor devices Part 16-5: Microwave integrated circuits - Oscillators
Published by BSI on September 30, 2013
A description is not available for this item.
View Less
View All
Advertisement