NEN-EN-IEC 60068-2-83
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 2011 |
| Status: | active |
| Page Count: | 48 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
scope:
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
Document History
NEN-EN-IEC 60068-2-83
October 1, 2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these...