NEN-EN-IEC 60749-16
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 June 2003 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Document History
NEN-EN-IEC 60749-16
June 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).