NEN-EN-IEC 60191-6-1
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 January 2002 |
| Status: | inactive |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This publication is intended to establish common rules on terminal shapes irrespective of package types.
Document History
NEN-EN-IEC 60191-6-1
January 1, 2002
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This...