NEN-EN-IEC 61249-8-8
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 1997 |
| Status: | active |
| Page Count: | 38 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed.
Document History
NEN-EN-IEC 61249-8-8
October 1, 1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed.