NEN-EN-IEC 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2010 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead- packages (SOJ), package outline form E in accordance with IEC 60191-4
Document History
NEN-EN-IEC 60191-6-20
November 1, 2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead- packages (SOJ), package outline form E in accordance with IEC 60191-4