NEN-EN-IEC 62047-12
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
| Organization: | NEN |
| Publication Date: | 1 November 2011 |
| Status: | active |
| Page Count: | 40 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechan
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