NEN-EN-IEC 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
active
| Organization: | NEN |
| Publication Date: | 1 November 2017 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
NEN-EN-IEC 61191-2 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).
Document History
November 1, 2019
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
A description is not available for this item.
NEN-EN-IEC 61191-2
November 1, 2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
NEN-EN-IEC 61191-2 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
October 1, 2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
January 1, 1999
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those...