NEN-EN-IEC 61190-1-1
Attachment materials for electronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronics assembly
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 2002 |
| Status: | active |
| Page Count: | 56 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
Document History
NEN-EN-IEC 61190-1-1
September 1, 2002
Attachment materials for electronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics. This standard is a flux characterization, quality control, and...