NEN-EN-IEC 61188-5-1
Printed boards and printed boards assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2002 |
| Status: | inactive |
| Page Count: | 156 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to aloow for inspection, testing and reqwork of those solder joints.
Document History
NEN-EN-IEC 61188-5-1
November 1, 2002
Printed boards and printed boards assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and...