NEN-EN-IEC 61249-3-4
Materials for printed boards and other interconnection structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 May 1999 |
| Status: | active |
| Page Count: | 42 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring.
Document History
NEN-EN-IEC 61249-3-4
May 1, 1999
Materials for printed boards and other interconnection structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring.