NEN-EN-IEC 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball gridd array (BGA)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 2003 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Covers the requirements for the measuring methods of ball grid aray (BGA) dimensions.
Document History
NEN-EN-IEC 60191-6-4
September 1, 2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball gridd array (BGA)
Covers the requirements for the measuring methods of ball grid aray (BGA) dimensions.