NEN-EN-IEC 60749-8
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 46 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this method is to determine the leak rate of semiconductor devices.
Document History
NEN-EN-IEC 60749-8
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this method is to determine the leak rate of semiconductor devices.