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IEC 62137-1-2

Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test

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Organization: IEC
Publication Date: 1 July 2007
Status: active
Page Count: 38
ICS Code (Electronic component assemblies): 31.190

Document History

IEC 62137-1-2
July 1, 2007
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test
A description is not available for this item.

References

This document is referenced by:
EN 62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by CENELEC on January 1, 2012
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
This document is referenced by:
CEI EN 62137-3 - Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by CEI on August 1, 2012
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
This document is referenced by:
62321-2 - Determination of certain substances in electrotechnical products – Part 2: Disassembly, disjointment and mechanical sample preparation
Published by IEC on August 1, 2021
This part of IEC 62321 provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products. These samples can be used for analytical testing to determine...
This document is referenced by:
BS EN IEC 62321-2 - Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
Published by BSI on November 30, 2021
A description is not available for this item.
This document is referenced by:
EN 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
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