NEN-EN-IEC 61188-5-6
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2003 |
| Status: | active |
| Page Count: | 52 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerance of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder points.
Document History
NEN-EN-IEC 61188-5-6
July 1, 2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerance of surface...