NEN-EN-IEC 61192-2
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 June 2003 |
| Status: | active |
| Page Count: | 142 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Specifies requirements for workmanships in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologys, for example, through-hole mounting.
Document History
NEN-EN-IEC 61192-2
June 1, 2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Specifies requirements for workmanships in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the...