NEN-EN-IEC 61190-1-2
Attachment materials for electronic assemblies - Part 1-2: Requirements for soldering pastes for high quality interconnections in electronics assembly
inactive
| Organization: | NEN |
| Publication Date: | 1 September 2002 |
| Status: | inactive |
| Page Count: | 50 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly.
Document History
June 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
NEN-EN-IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard...
August 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
NEN-EN-IEC 61190-1-2
September 1, 2002
Attachment materials for electronic assemblies - Part 1-2: Requirements for soldering pastes for high quality interconnections in electronics assembly
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly.