NEN - NPR-ES 59008-5-3
Data requirements for semiconductor die - Part 5-3: Particular requirements and recommendations for die types - Minimally-packaged die
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 December 2001 |
| Status: | active |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die.
Document History
NPR-ES 59008-5-3
December 1, 2001
Data requirements for semiconductor die - Part 5-3: Particular requirements and recommendations for die types - Minimally-packaged die
Specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die.