NEN-EN-IEC 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 November 2001 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid-array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Document History
NEN-EN-IEC 60191-6-5
November 1, 2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid-array whose terminal pitch is less than, or equal to, 0,80 mm and whose...