NEN - NPR-ES 59008-4-3
Data requirements for semiconductor die - Part 4-3: Specific requirements and recommendations - Thermal
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 January 2000 |
| Status: | inactive |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. Also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. Specifies requirements relating specifically to operational thermal conditions of unpackaged and minimally packaged semiconductor die.
Document History
NPR-ES 59008-4-3
January 1, 2000
Data requirements for semiconductor die - Part 4-3: Specific requirements and recommendations - Thermal
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. Also gives recommendations for...