NEN 10249-3-1
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 1982 |
| Status: | inactive |
| Page Count: | 26 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This specification gives the requirements for properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed circuits formed from metal-clad epoxide glass laminates to produce multilayer printed boards.
Document History
NEN 10249-3-1
October 1, 1982
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
This specification gives the requirements for properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed...