NEN-EN-IEC 60749-31
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine the device ignites due to internal heating caused by excessive overloads.
Document History
NEN-EN-IEC 60749-31
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine the device ignites due to internal heating caused by excessive overloads.