NEN-EN-IEC 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
inactive
| Organization: | NEN |
| Publication Date: | 1 August 2003 |
| Status: | inactive |
| Page Count: | 64 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Applies to semiconductor devices (discrete devices and integrated circuits). This test method provide a means of assessing the resistance to soldering heat of plastic-encapsulated
Document History
October 1, 2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
December 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
NEN-EN-IEC 60749-20
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Applies to semiconductor devices (discrete devices and integrated circuits). This test method provide a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount...