NEN-EN-IEC 61189-2/A1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
inactive
| Organization: | NEN |
| Publication Date: | 1 July 2000 |
| Status: | inactive |
| Page Count: | 44 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
October 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
NEN-EN-IEC 61189-2/A1
July 1, 2000
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
October 1, 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies 2: Test methods for materials for interconnection structures
A description is not available for this item.
August 1, 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
This part is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and...