NEN-EN-IEC 61249-3-5
Materials for printed boards and other interconnection structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 May 1999 |
| Status: | active |
| Page Count: | 40 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
Document History
NEN-EN-IEC 61249-3-5
May 1, 1999
Materials for printed boards and other interconnection structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.