NEN-EN-IEC 61188-5-2
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 2003 |
| Status: | active |
| Page Count: | 118 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Document History
NEN-EN-IEC 61188-5-2
October 1, 2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns...