scope:

Specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknessess from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test for verification of conformity to the requirements of this standard, and the delivery conditions are also specified.