NEN - NVN-IEC/TS 61189-3-301
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 August 2016 |
| Status: | active |
| Page Count: | 23 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
IEC 61189-3-301 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.
Document History
NVN-IEC/TS 61189-3-301
August 1, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
IEC 61189-3-301 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold,...