NEN-EN-IEC 61189-5
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 2006 |
| Status: | active |
| Page Count: | 76 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Document History
NEN-EN-IEC 61189-5
October 1, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.