NEN-EN-IEC 61192-3
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2003 |
| Status: | active |
| Page Count: | 108 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Document History
NEN-EN-IEC 61192-3
July 1, 2003
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic...