scope:

This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of automotive electronic control units (ECU). These requirements include, but are not limited to, measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.